Method for integrating microelectromechanical devices with electronic circuitry
Patent
·
OSTI ID:871797
- Albuquerque, NM
A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.
- Research Organization:
- SANDIA CORP
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- US 5798283
- OSTI ID:
- 871797
- Country of Publication:
- United States
- Language:
- English
Polysilicon integrated microsystems: technologies and applications
|
journal | August 1996 |
A smart accelerometer with on-chip electronics fabricated by a commercial CMOS process
|
journal | March 1992 |
A surface micromachined silicon accelerometer with on-chip detection circuitry
|
journal | October 1994 |
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