Recrystallization method to selenization of thin-film Cu(In,Ga)Se.sub.2 for semiconductor device applications
Patent
·
OSTI ID:870002
- Denver, CO
- Evergreen, CO
- Golden, CO
- Boulder, CO
A process for fabricating slightly Cu-poor thin-films of Cu(In,Ga)Se.sub.2 on a substrate for semiconductor device applications includes the steps of forming initially a slightly Cu-rich, phase separated, mixture of Cu(In,Ga)Se.sub.2 :Cu.sub.x Se on the substrate in solid form followed by exposure of the Cu(In,Ga)Se.sub.2 :Cu.sub.x Se solid mixture to an overpressure of Se vapor and (In,Ga) vapor for deposition on the Cu(In,Ga)Se.sub.2 :Cu.sub.x Se solid mixture while simultaneously increasing the temperature of the solid mixture toward a recrystallization temperature (about 550.degree. C.) at which Cu(In,Ga)Se.sub.2 is solid and Cu.sub.x Se is liquid. The (In,Ga) flux is terminated while the Se overpressure flux and the recrystallization temperature are maintained to recrystallize the Cu.sub.x Se with the (In, Ga) that was deposited during the temperature transition and with the Se vapor to form the thin-film of slightly Cu-poor Cu.sub.x (In,Ga).sub.y Se.sub.z. The initial Cu-rich, phase separated large grain mixture of Cu(In,Ga)Se.sub.2 :Cu.sub.x Se can be made by sequentially depositing or co-depositing the metal precursors, Cu and (In, Ga), on the substrate at room temperature, ramping up the thin-film temperature in the presence of Se overpressure to a moderate anneal temperature (about 450.degree. C.) and holding that temperature and the Se overpressure for an annealing period. A nonselenizing, low temperature anneal at about 100.degree. C. can also be used to homogenize the precursors on the substrates before the selenizing, moderate temperature anneal.
- Research Organization:
- Argonne National Laboratory (ANL), Argonne, IL
- Assignee:
- Midwest Research Institute (Kansas City, MO)
- Patent Number(s):
- US 5436204
- Application Number:
- 08/293,826
- OSTI ID:
- 870002
- Country of Publication:
- United States
- Language:
- English
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increasing
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selenization
selenizing
semiconductor
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slightly
slightly cu-poor
solid
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solid mixture
steps
substrate
substrates
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terminated
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100
450
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anneal
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applications
co-depositing
cu
cu-poor
cu-rich
degree
deposited
depositing
deposition
device
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exposure
fabricating
film temperature
flux
followed
form
forming
grain
holding
homogenize
increasing
initial
initially
liquid
maintained
metal
metal precursor
metal precursors
method
mixture
moderate
moderate temperature
nonselenizing
overpressure
period
phase
phase separate
phase separated
precursors
presence
process
ramping
rate temperature
recrystallization
recrystallization temperature
recrystallize
selenization
selenizing
semiconductor
semiconductor device
separated
sequentially
simultaneously
slightly
slightly cu-poor
solid
solid form
solid mixture
steps
substrate
substrates
temperature
temperature anneal
terminated
thin-film
thin-films
transition
vapor
z