Light-induced voltage alteration for integrated circuit analysis

Soden, Jerry M

Light-induced voltage alteration for integrated circuit analysis

Patent · Sat Dec 31 23:00:00 EST 1994

OSTI ID:869963

Soden, Jerry M ^[1]

Placitas, NM

An apparatus and method are described for analyzing an integrated circuit (IC), The invention uses a focused light beam that is scanned over a surface of the IC to generate a light-induced voltage alteration (LIVA) signal for analysis of the IC, The LIVA signal may be used to generate an image of the IC showing the location of any defects in the IC; and it may be further used to image and control the logic states of the IC. The invention has uses for IC failure analysis, for the development of ICs, for production-line inspection of ICs, and for qualification of ICs.

Research Organization:: SANDIA CORP

DOE Contract Number:: AC04-94AL85000

Assignee:: United States of America as represented by United States (Washington, DC)

Patent Number(s):: US 5430305

OSTI ID:: 869963

Country of Publication:: United States

Language:: English

References (7)

Novel failure analysis techniques using photon probing with a scanning optical microscope Cole, E. I.; Soden, J. M.; Rife, J. L. Proceedings of 1994 IEEE International Reliability Physics Symposium https://doi.org/10.1109/RELPHY.1994.307808	conference	January 1994
Logic Failure Analysis of CMOS VLSI using a Laser Probe Henley, F. J. 22nd International Reliability Physics Symposium https://doi.org/10.1109/IRPS.1984.362022	conference	April 1984
Detection and localization of gate oxide shorts in MOS transistors by optical-beam-induced current Zanoni, E.; Spiazzi, G.; Dalla Libera, G. IEEE Transactions on Electron Devices, Vol. 38, Issue 2 https://doi.org/10.1109/16.69925	journal	January 1991
IC failure analysis: techniques and tools for quality reliability improvement Soden, J. M.; Anderson, R. E. Proceedings of the IEEE, Vol. 81, Issue 5 https://doi.org/10.1109/5.220902	journal	May 1993
Laser scanning of MOS IC's reveals internal logic states nondestructively Sawyer, D. E.; Berning, D. W. Proceedings of the IEEE, Vol. 64, Issue 3 https://doi.org/10.1109/PROC.1976.10140	journal	January 1976
Rapid localization of IC open conductors using charge-induced voltage alteration (CIVA) Cole, E. I.; Anderson, R. E. 30th Annual Proceedings Reliability Physics 1992 https://doi.org/10.1109/RELPHY.1992.187659	conference	January 1992
Imaging Latch-Up Sites in LSI CMOS with a Laser Photoscanner Burns, Daniel J.; Kendall, Jeffrey M. 21st International Reliability Physics Symposium https://doi.org/10.1109/IRPS.1983.361971	conference	April 1983

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Related Subjects

/250/
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analysis
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beam
circuit
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control
defects
described
failure
failure analysis
focused
generate
ics
image
inspection
integrated
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light
light beam
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liva
location
logic
method
production-line
qualification
scanned
signal
surface
voltage
voltage alteration

Light-induced voltage alteration for integrated circuit analysis

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References (7)

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