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Josephson junction

Patent ·
OSTI ID:869862

A novel method for fabricating nanometer geometry electronic devices is described. Such Josephson junctions can be accurately and reproducibly manufactured employing photolithographic and direct write electron beam lithography techniques in combination with aqueous etchants. In particular, a method is described for manufacturing planar Josephson junctions from high temperature superconducting material.

Research Organization:
AT & T CORP
DOE Contract Number:
AC04-76DP00789
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 5411937
OSTI ID:
869862
Country of Publication:
United States
Language:
English

References (9)

Measurement of conduction properties of highly resistive superconducting microbridges journal March 1993
Improved aqueous etchant for high T c superconductor materials journal April 1992
Orientation Dependence of Grain-Boundary Critical Currents in Y Ba 2 Cu 3 O 7 − δ Bicrystals journal July 1988
Fabrication and measurement of submicron planar YBa/sub 2/Cu/sub 3/O/sub 7/ microbridge Josephson junctions journal March 1993
Millimeter wave responses of YBCO variable-thickness bridges journal March 1993
High temperature superconducting Josephson transmission lines for pulse and step sharpening journal December 1992
YBa 2 Cu 3 O 7 nanobridges fabricated by direct‐write electron beam lithography journal September 1992
Bi‐epitaxial grain boundary junctions in YBa 2 Cu 3 O 7 journal August 1991
Substrate step‐edge YBa 2 Cu 3 O 7 rf SQUIDs journal February 1991