Methods for patterned deposition on a substrate
- Albuquerque, NM
A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto.
- Research Organization:
- AT & T CORP
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- Sandia Corporation (Albuquerque, NM)
- Patent Number(s):
- US 5380474
- OSTI ID:
- 869700
- Country of Publication:
- United States
- Language:
- English
Selective low-temperature chemical vapor deposition of copper from (hexafluoroacetylacetonato)copper(I)trimethylphosphine, (hfa)CuP(Me)3
|
journal | May 1991 |
Similar Records
Patterned deposition of copper on poly(tetrafluoroethylene)
Metallization of ceramics
Related Subjects
adhesion
adhesion characteristics
adhesions
beam
characteristics
chemically
chemically etched
conductor
copper
define
deposition
depositions
described
diminished
embodiment
enhanced
enhanced adhesion
etched
etched surface
form
improve
irradiated
laser
laser beam
layer
material
method
methods
pattern
patterned
patterned deposition
patterns
polymeric
polymeric substrate
portions
ptfe
remaining
remove
removed
selected
selected portion
selected portions
substrate
surface
thereafter
thereto