Metallization of ceramics
Patent
·
OSTI ID:5281103
This patent describes a method of making a printed circuit on a surface of a ceramic substrate comprising: treating the ceramic substrate with a molten alkali metal compound to adhesion promote or etch the surface; exposing the surface to acidic halide solution containing one or more halides selected from the group consisting of chlorides, bromides, and iodides having an acidity and a halide concentration sufficient to eliminate bare spots in an adherent metal layer formed on the surface or selected parts thereof, wherein the acidic halide solution contains at least 1.5 moles of halide per liter; treating the ceramic surface with a catalyst for electroless metal deposition; depositing metal onto the catalyzed surface; and removing portions of the deposited metal to produce a metal printed circuit conductor pattern adhering to the surface of the ceramic substrate.
- Assignee:
- Kollmorgen Technologies Corp., Dallas, TX
- Patent Number(s):
- US 4604299
- OSTI ID:
- 5281103
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360101 -- Metals & Alloys-- Preparation & Fabrication
360201 -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ADHESION
ALKALI METAL COMPOUNDS
BROMIDES
BROMINE COMPOUNDS
CATALYSTS
CERAMICS
CHLORIDES
CHLORINE COMPOUNDS
DEPOSITION
ELECTRONIC CIRCUITS
ETCHING
FABRICATION
HALIDES
HALOGEN COMPOUNDS
IODIDES
IODINE COMPOUNDS
PH VALUE
PRINTED CIRCUITS
QUANTITY RATIO
SUBSTRATES
SURFACE FINISHING
SURFACE TREATMENTS
360101 -- Metals & Alloys-- Preparation & Fabrication
360201 -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ADHESION
ALKALI METAL COMPOUNDS
BROMIDES
BROMINE COMPOUNDS
CATALYSTS
CERAMICS
CHLORIDES
CHLORINE COMPOUNDS
DEPOSITION
ELECTRONIC CIRCUITS
ETCHING
FABRICATION
HALIDES
HALOGEN COMPOUNDS
IODIDES
IODINE COMPOUNDS
PH VALUE
PRINTED CIRCUITS
QUANTITY RATIO
SUBSTRATES
SURFACE FINISHING
SURFACE TREATMENTS