Surface preparation of ceramic substrates for metallization
Patent
·
OSTI ID:7078389
This patent describes a process for metallizing a surface of a ceramic substrate which includes adhesion promoting the surface with an alkali metal composition containing one or more alkali metal compounds and subsequently depositing metal on the adhesion promoted surface. The improvement described here in the adhesion promoting step comprises: providing an admixture comprised of the alkali metal composition and an inert solid material which is not dissolved or melted by the molten alkali metal composition up to and during the adhesion promotion step; contacting the ceramic surface with the admixture; heating the admixture and the substrate for a time period and at or above a temperature at which the alkali metal composition becomes molten and which is sufficient to adhesion promote the ceramic surface and render it receptive to subsequent adherent metal deposition. The presence of the inert solid material in the admixture prevents coalescence of the alkali metal composition on the ceramic surface during the adhesion promotion.
- Assignee:
- Kollmorgen Technologies Corp., Dallas, TX
- Patent Number(s):
- US 4647477
- OSTI ID:
- 7078389
- Country of Publication:
- United States
- Language:
- English
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