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Title: Microchannel heat sink assembly

Abstract

The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated at a high pressure. The heat sink comprises a microchannel layer preferably formed of silicon, and a manifold layer preferably formed of glass. The manifold layer comprises an inlet groove and outlet groove which define an inlet manifold and an outlet manifold. The inlet manifold delivers coolant to the inlet section of the microchannels, and the outlet manifold receives coolant from the outlet section of the microchannels. In one embodiment, the manifold layer comprises an inlet hole extending through the manifold layer to the inlet manifold, and an outlet hole extending through the manifold layer to the outlet manifold. Coolant is supplied to the heat sink through a conduit assembly connected to the heat sink. A resilient seal, such as a gasket or an O-ring, is disposed between the conduit and the hole in the heat sink in order to provide a watetight seal. In other embodiments, the conduit assembly may comprise a metal tube which is connected tomore » the heat sink by a soft solder. In still other embodiments, the heat sink may comprise inlet and outlet nipples. The present invention has application in supercomputers, integrated circuits and other electronic devices, and is suitable for cooling materials to superconducting temperatures.« less

Inventors:
 [1];  [2]
  1. (Livermore, CA)
  2. (Pleasanton, CA)
Publication Date:
Research Org.:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
OSTI Identifier:
868210
Patent Number(s):
US 5099311
Assignee:
United States of America as represented by United States (Washington, DC) LLNL
DOE Contract Number:
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
microchannel; heat; sink; assembly; provides; thermal; range; cryogenic; temperatures; hundred; degrees; centigrade; variety; fluids; corrosive; operated; pressure; comprises; layer; preferably; formed; silicon; manifold; glass; inlet; groove; outlet; define; delivers; coolant; section; microchannels; receives; embodiment; extending; supplied; conduit; connected; resilient; seal; gasket; o-ring; disposed; provide; watetight; embodiments; comprise; metal; tube; soft; solder; nipples; application; supercomputers; integrated; circuits; electronic; devices; suitable; cooling; materials; superconducting; assembly connected; outlet manifold; cryogenic temperature; inlet manifold; superconducting temperatures; preferably formed; cryogenic temperatures; layer comprises; heat sink; integrated circuits; integrated circuit; electronic devices; degrees centigrade; metal tube; microchannel heat; tight seal; electronic device; channel heat; superconducting temperature; hundred degrees; corrosive fluids; /165/257/361/439/

Citation Formats

Bonde, Wayne L., and Contolini, Robert J. Microchannel heat sink assembly. United States: N. p., 1992. Web.
Bonde, Wayne L., & Contolini, Robert J. Microchannel heat sink assembly. United States.
Bonde, Wayne L., and Contolini, Robert J. Wed . "Microchannel heat sink assembly". United States. doi:. https://www.osti.gov/servlets/purl/868210.
@article{osti_868210,
title = {Microchannel heat sink assembly},
author = {Bonde, Wayne L. and Contolini, Robert J.},
abstractNote = {The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated at a high pressure. The heat sink comprises a microchannel layer preferably formed of silicon, and a manifold layer preferably formed of glass. The manifold layer comprises an inlet groove and outlet groove which define an inlet manifold and an outlet manifold. The inlet manifold delivers coolant to the inlet section of the microchannels, and the outlet manifold receives coolant from the outlet section of the microchannels. In one embodiment, the manifold layer comprises an inlet hole extending through the manifold layer to the inlet manifold, and an outlet hole extending through the manifold layer to the outlet manifold. Coolant is supplied to the heat sink through a conduit assembly connected to the heat sink. A resilient seal, such as a gasket or an O-ring, is disposed between the conduit and the hole in the heat sink in order to provide a watetight seal. In other embodiments, the conduit assembly may comprise a metal tube which is connected to the heat sink by a soft solder. In still other embodiments, the heat sink may comprise inlet and outlet nipples. The present invention has application in supercomputers, integrated circuits and other electronic devices, and is suitable for cooling materials to superconducting temperatures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Wed Jan 01 00:00:00 EST 1992},
month = {Wed Jan 01 00:00:00 EST 1992}
}

Patent:

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  • The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated at a high pressure. The heat sink comprises a microchannel layer preferably formed of silicon, and a manifold layer preferably formed of glass. The manifold layer comprises an inlet groove and outlet groove which define an inlet manifold and an outlet manifold. The inlet manifold delivers coolant to the inlet section of the microchannels, and the outlet manifold receivesmore » coolant from the outlet section of the microchannels. In one embodiment, the manifold layer comprises an inlet hole extending through the manifold layer to the inlet manifold, and an outlet hole extending through the manifold layer to the outlet manifold. Coolant is supplied to the heat sink through a conduit assembly connected to the heat sink. A resilient seal, such as a gasket or an O-ring, is disposed between the conduit and the hole in the heat sink in order to provide a watertight seal. In other embodiments, the conduit assembly may comprise a metal tube which is connected to the heat sink by a soft solder. In still other embodiments, the heat sink may comprise inlet and outlet nipples. The present invention has application in supercomputers, integrated circuits and other electronic devices, and is suitable for cooling materials to superconducting temperatures. 13 figs.« less
  • A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.
  • An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.
  • An extensive experimental campaign has been carried out for the measurement of saturated critical heat flux in a multi-microchannel copper heat sink. The heat sink was formed by 29 parallel channels that were 199 {mu}m wide and 756 {mu}m deep. In order to increase the critical heat flux and reduce the two-phase pressure drop, a split flow system was implemented with one central inlet at the middle of the channels and two outlets at either end. The base critical heat flux was measured using three HFC Refrigerants (R134a, R236fa and R245fa) for mass fluxes ranging from 250 to 1500 kg/m{supmore » 2} s, inlet subcoolings from -25 to -5 K and saturation temperatures from 20 to 50 C. The parametric effects of mass velocity, saturation temperature and inlet subcooling were investigated. The analysis showed that significantly higher CHF was obtainable with the split flow system (one inlet-two outlets) compared to the single inlet-single outlet system, providing also a much lower pressure drop. Notably several existing predictive methods matched the experimental data quite well and quantitatively predicted the benefit of higher CHF of the split flow. (author)« less
  • A heat-transfer interface between and separating a high temperature heat source and a heat sink is formed by the adjacent walls of the heat source and heat sink with a thin gap between these walls and helium gas sealed in the gap, the walls preferably defining concentric hemispheres; this interface being particularly feasible as separable walls of the heater portion of a Stirling engine and a heat source.