Method of bonding metals to ceramics

Patent · Wed Jan 01 04:00:00 EST 1992

OSTI ID:868118

Maroni, Victor A ^[1]

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1. Naperville, IL

A method of forming a composite by providing a ceramic capable of having zero electrical resistance and complete diamagnetism at superconducting temperatures, bonding a thin layer of Ag, Au or alloys thereof with the ceramic. Thereafter, there is bonded a first metal to the ceramic surface at a temperature less than about 400.degree. C., and then a second metal is bonded to the first metal at a temperature less than about 400.degree. C. to form a composite wherein the first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Ti and alloys thereof and wherein the second metal is selected from the class consisting of Al, Cu, Pb and Zn and alloys thereof.

• Research Organization: Argonne National Laboratory (ANL), Argonne, IL
• DOE Contract Number: W-31109-ENG-38
• Assignee: Arch Development Corporation (Chicago, IL)
• Patent Number(s): US 5079223
• OSTI ID: 868118
• Country of Publication: United States
• Language: English

Related Subjects

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