Method of bonding metals to ceramics
Patent
·
OSTI ID:5526171
This patent describes a method of forming a composite. It comprises providing a ceramic capable of having zero electrical resistance and complete diamagnetism at superconducting temperatures, bonding a layer of Ag, Au or alloys thereof with the ceramic, pressure bonding a first metal of ln or an alloy thereof the to layer of Ag, Au or alloys thereof at a temperature less than the melting point of the ln or ln alloy, bonding a second metal to the ln or ln alloy to form a composite wherein the second metal is selected from the class consisting of Al, Cu, Pb and Zn and alloys thereof.
- Assignee:
- Arch Development Corp., Chicago, IL (United States)
- Patent Number(s):
- A; US 5079223
- Application Number:
- PPN: US 7-566780
- OSTI ID:
- 5526171
- Country of Publication:
- United States
- Language:
- English
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