Method of bonding metals to ceramics
Patent
·
OSTI ID:7276872
A ceramic or glass having a thin layer of silver, gold or alloys thereof at the surface thereof is disclosed. A first metal is bonded to the thin layer and a second metal is bonded to the first metal. The first metal is selected from the class consisting of In, Ga, Sn, Bi, Zn, Cd, Pb, Tl and alloys thereof, and the second metal is selected from the class consisting of Cu, Al, Pb, Au and alloys thereof. 3 figures.
- DOE Contract Number:
- W-31109-ENG-38
- Assignee:
- Arch Development Corporation, Chicago, IL (United States)
- Patent Number(s):
- US 5010053; A
- Application Number:
- PPN: US 7-286238
- OSTI ID:
- 7276872
- Country of Publication:
- United States
- Language:
- English
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