Magnetron with flux switching cathode and method of operation
- University City, MO
- Madison, WI
A magnetron sputtering apparatus is formed with a plurality of cells each for generating an independent magnetic field within a different region in the chamber of the apparatus. Each magnetic field aids in maintaining an ion plasma in the respective region of the chamber. One of a plurality of sputtering material targets is positioned on an electrode adjacent to each region so that said ions strike the target ejecting some of the target material. By selectively generating each magnetic field, the ion plasma may be moved from region to region to sputter material from different targets. The sputtered material becomes deposited on a substrate mounted on another electrode within the chamber. The duty cycle of each cell can be dynamically varied during the deposition to produce a layer having a graded composition throughout its thickness.
- Research Organization:
- University of Wisconsin
- DOE Contract Number:
- FG02-84ER45096
- Assignee:
- Wisconsin Alumni Research Foundation (Madison, WI)
- Patent Number(s):
- US 4865710
- OSTI ID:
- 867103
- Country of Publication:
- United States
- Language:
- English
Similar Records
Review of ionized-PVD by hollow cathode magnetron sputtering
Very low pressure high power impulse triggered magnetron sputtering
Related Subjects
adjacent
aids
apparatus
cathode
cell
cells
chamber
composition
cycle
deposited
deposition
duty
duty cycle
dynamically
dynamically varied
ejecting
electrode
field
flux
formed
generating
graded
graded composition
independent
independent magnetic
layer
magnetic
magnetic field
magnetron
magnetron sputter
magnetron sputtering
maintaining
material
method
mounted
moved
operation
plasma
plurality
positioned
produce
region
respective
selectively
sputter
sputtered
sputtering
sputtering apparatus
strike
substrate
switching
target
target mater
target material
targets
thickness
throughout
varied