Magnetron with flux switching cathode and method of operation

Patent · Tue Sep 12 04:00:00 EDT 1989

OSTI ID:7018784

Aaron, D B; Wiley, J D

A magnetron sputtering apparatus is formed with a plurality of cells each for generating an independent magnetic field within a different region in the chamber of the apparatus. Each magnetic field aids in maintaining an ion plasma in the respective region of the chamber. One of a plurality of sputtering material targets is positioned on an electrode adjacent to each region so that said ions strike the target ejecting some of the target material. By selectively generating each magnetic field, the ion plasma may be moved from region to region to sputter material from different targets. The sputtered material becomes deposited on a substrate mounted on another electrode within the chamber. The duty cycle of each cell can be dynamically varied during the deposition to produce a layer having a graded composition throughout its thickness. 5 figs.

• DOE Contract Number: FG02-84ER45096
• Assignee: Wisconsin Alumni Research Foundation, Madison, WI (United States)
• Patent Number(s): A; US 4865710
• Application Number: PPN: US 7-175711
• OSTI ID: 7018784
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101 -- Metals & Alloys-- Preparation & Fabrication
360201 -- Ceramics
Cermets
& Refractories-- Preparation & Fabrication
360601 -- Other Materials-- Preparation & Manufacture
42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
DEPOSITION
DESIGN
ELECTRON TUBES
ELECTRONIC EQUIPMENT
EQUIPMENT
MAGNETRONS
MATERIALS
MICROWAVE EQUIPMENT
MICROWAVE TUBES
OPERATION
PLASMA
SPUTTERING