Magnetron with flux switching cathode and method of operation
A magnetron sputtering apparatus is formed with a plurality of cells each for generating an independent magnetic field within a different region in the chamber of the apparatus. Each magnetic field aids in maintaining an ion plasma in the respective region of the chamber. One of a plurality of sputtering material targets is positioned on an electrode adjacent to each region so that said ions strike the target ejecting some of the target material. By selectively generating each magnetic field, the ion plasma may be moved from region to region to sputter material from different targets. The sputtered material becomes deposited on a substrate mounted on another electrode within the chamber. The duty cycle of each cell can be dynamically varied during the deposition to produce a layer having a graded composition throughout its thickness. 5 figs.
- DOE Contract Number:
- FG02-84ER45096
- Assignee:
- Wisconsin Alumni Research Foundation, Madison, WI (United States)
- Patent Number(s):
- US 4865710; A
- Application Number:
- PPN: US 7-175711
- OSTI ID:
- 7018784
- Resource Relation:
- Patent File Date: 31 Mar 1988
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
MAGNETRONS
DESIGN
OPERATION
MATERIALS
SPUTTERING
DEPOSITION
PLASMA
ELECTRON TUBES
ELECTRONIC EQUIPMENT
EQUIPMENT
MICROWAVE EQUIPMENT
MICROWAVE TUBES
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