Very low pressure high power impulse triggered magnetron sputtering
Patent
·
OSTI ID:1107788
A method and apparatus are described for very low pressure high powered magnetron sputtering of a coating onto a substrate. By the method of this invention, both substrate and coating target material are placed into an evacuable chamber, and the chamber pumped to vacuum. Thereafter a series of high impulse voltage pulses are applied to the target. Nearly simultaneously with each pulse, in one embodiment, a small cathodic arc source of the same material as the target is pulsed, triggering a plasma plume proximate to the surface of the target to thereby initiate the magnetron sputtering process. In another embodiment the plasma plume is generated using a pulsed laser aimed to strike an ablation target material positioned near the magnetron target surface.
- Research Organization:
- LBNL (Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States))
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC03-76SF00098; AC02-05CH11231
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Number(s):
- 8,568,572
- Application Number:
- 12/797,829
- OSTI ID:
- 1107788
- Country of Publication:
- United States
- Language:
- English
Similar Records
Method and apparatus for improved high power impulse magnetron sputtering
Tutorial: Reactive high power impulse magnetron sputtering (R-HiPIMS)
High power impulse magnetron sputtering discharge
Patent
·
Mon Nov 04 23:00:00 EST 2013
·
OSTI ID:1107879
Tutorial: Reactive high power impulse magnetron sputtering (R-HiPIMS)
Journal Article
·
Mon Mar 20 20:00:00 EDT 2017
· Journal of Applied Physics
·
OSTI ID:1379841
High power impulse magnetron sputtering discharge
Journal Article
·
Tue May 15 00:00:00 EDT 2012
· Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films
·
OSTI ID:22054153