Method and apparatus for improved high power impulse magnetron sputtering
Patent
·
OSTI ID:1107879
A high power impulse magnetron sputtering apparatus and method using a vacuum chamber with a magnetron target and a substrate positioned in the vacuum chamber. A field coil being positioned between the magnetron target and substrate, and a pulsed power supply and/or a coil bias power supply connected to the field coil. The pulsed power supply connected to the field coil, and the pulsed power supply outputting power pulse widths of greater that 100 .mu.s.
- Research Organization:
- LBNL (Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States))
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC02-05CH11231
- Assignee:
- The Regents of the University of California (Oakland, CA)
- Patent Number(s):
- 8,574,410
- Application Number:
- 12/989,378
- OSTI ID:
- 1107879
- Country of Publication:
- United States
- Language:
- English
Similar Records
Very low pressure high power impulse triggered magnetron sputtering
High power impulse magnetron sputtering discharge
An apparatus for magnetron sputter coating and plasma immersion ion implantation
Patent
·
Tue Oct 29 00:00:00 EDT 2013
·
OSTI ID:1107788
High power impulse magnetron sputtering discharge
Journal Article
·
Tue May 15 00:00:00 EDT 2012
· Journal of Vacuum Science and Technology. A, International Journal Devoted to Vacuum, Surfaces, and Films
·
OSTI ID:22054153
An apparatus for magnetron sputter coating and plasma immersion ion implantation
Conference
·
Mon Dec 30 23:00:00 EST 1996
·
OSTI ID:477417