Electrically conductive resinous bond and method of manufacture

Patent · Wed Dec 31 23:00:00 EST 1986

OSTI ID:866253

Wells, Barbara J ^[1]

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1. 865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702

A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40.degree. to 365.degree. C. to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.

• Research Organization: GENERAL ELECTRIC CO
• DOE Contract Number: AC04-76DP00656
• Assignee: Snowden, Jr.; Thomas M. (P.O. Box 4231, Clearwater, FL 33518); Wells; Barbara J. (865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702)
• Patent Number(s): US 4666547
• OSTI ID: 866253
• Country of Publication: United States
• Language: English

Related Subjects

/156/29/310/428/
365
40
adhesive
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metal-filled
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minor
minor amount
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polyimide
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resinous
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substantially
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