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Title: Electrically conductive resinous bond and method of manufacture

Abstract

A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40.degree. to 365.degree. C. to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.

Inventors:
 [1]
  1. 865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702
Publication Date:
Research Org.:
General Electric Co., Boston, MA (United States)
OSTI Identifier:
866253
Patent Number(s):
US 4666547
Assignee:
Snowden, Jr.; Thomas M. (P.O. Box 4231, Clearwater, FL 33518); Wells; Barbara J. (865 N. Village Dr., Apt. 101B, St. Petersburg, FL 33702)
DOE Contract Number:  
AC04-76DP00656
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
electrically; conductive; resinous; bond; method; manufacture; bonding; elements; strength; electrical; conductivity; comprises; applying; unfilled; polyimide; resin; surfaces; bonded; heat; treating; stages; temperature; range; 40; degree; 365; form; strong; adhesive; metal-filled; overcoat; provide; connection; therebetween; substantially; profile; concerned; resilient; void; free; combination; providing; attachment; major; amount; minor; provide electrical; major amount; temperature profile; temperature range; electrically conductive; electrical conductivity; electrical connection; minor amount; heat treating; polyimide resin; void free; substantially void; conductive elements; conductive adhesive; adhesive bond; provide electric; /156/29/310/428/

Citation Formats

Snowden, Jr., Thomas M., and Wells, Barbara J. Electrically conductive resinous bond and method of manufacture. United States: N. p., 1987. Web.
Snowden, Jr., Thomas M., & Wells, Barbara J. Electrically conductive resinous bond and method of manufacture. United States.
Snowden, Jr., Thomas M., and Wells, Barbara J. Thu . "Electrically conductive resinous bond and method of manufacture". United States. https://www.osti.gov/servlets/purl/866253.
@article{osti_866253,
title = {Electrically conductive resinous bond and method of manufacture},
author = {Snowden, Jr., Thomas M. and Wells, Barbara J},
abstractNote = {A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40.degree. to 365.degree. C. to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.},
doi = {},
url = {https://www.osti.gov/biblio/866253}, journal = {},
number = ,
volume = ,
place = {United States},
year = {1987},
month = {1}
}

Patent:

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