Thermal conductivity and interface resistance of particle-filled silicone resin
The thermal conductivity of silicone resin containing various amounts of Al/sub 2/O/sub 3/, MgO, BN and copper particles was measured with a Colora Thermoconductometer. Samples consisted of aluminum and alumina discs bonded with unfilled or particle-filled resin. Most particle loaded samples displayed a conductivity that declined with decreasing bond thickness. This is due to a measurable interface thermal resistance which probably results from the increased viscosity and reduced wetting ability of particle-loaded resin. Microscopic examination of bond cross sections revealed such areas of incomplete contact. No interface resistance was observed for unfilled resin where wetting appeared complete.
- Research Organization:
- BDM Corp., Albuquerque, NM (USA); Sandia National Labs., Albuquerque, NM (USA)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 6838565
- Report Number(s):
- SAND-83-2375C; CONF-840816-10; ON: DE84011681
- Country of Publication:
- United States
- Language:
- English
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360603 -- Materials-- Properties
ALKALINE EARTH METAL COMPOUNDS
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
BORON COMPOUNDS
BORON NITRIDES
CHALCOGENIDES
DATA
EXPERIMENTAL DATA
INFORMATION
MAGNESIUM COMPOUNDS
MAGNESIUM OXIDES
NITRIDES
NITROGEN COMPOUNDS
NUMERICAL DATA
ORGANIC COMPOUNDS
ORGANIC POLYMERS
ORGANIC SILICON COMPOUNDS
OXIDES
OXYGEN COMPOUNDS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
PNICTIDES
POLYMERS
RESINS
SILICONES
SILOXANES
THERMAL CONDUCTIVITY
THERMODYNAMIC PROPERTIES