Electrically conductive resinous bond and method of manufacture
A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40 to 365/sup 0/C to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.
- Research Organization:
- General Electric Co., St. Petersburg, FL (USA)
- DOE Contract Number:
- AC04-76DP00656
- Assignee:
- Dept. of Energy
- Patent Number(s):
- None
- Application Number:
- ON: DE86013793
- OSTI ID:
- 5656731
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ADHESIVES
BONDING
CHALCOGENIDES
ELECTRONIC EQUIPMENT
EQUIPMENT
FABRICATION
HEAT TREATMENTS
JOINING
MINERALS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
OXIDE MINERALS
OXIDES
OXYGEN COMPOUNDS
PETROCHEMICALS
PETROLEUM PRODUCTS
POLYMERS
QUARTZ
RESINS
RESONATORS
SILICON COMPOUNDS
SILICON OXIDES