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Method of sputter etching a surface

Patent ·
OSTI ID:864875

The surface of a target is textured by co-sputter etching the target surface with a seed material adjacent thereto, while the target surface is maintained at a pre-selected temperature. By pre-selecting the temperature of the surface while sputter etching, it is possible to predetermine the reflectance properties of the etched surface. The surface may be textured to absorb sunlight efficiently and have minimal emittance in the infrared region so as to be well-suited for use as a solar absorber for photothermal energy conversion.

Research Organization:
BATTELLE MEMORIAL INSTITUTE
DOE Contract Number:
AC06-76RL01830
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Number(s):
US 4431499
OSTI ID:
864875
Country of Publication:
United States
Language:
English

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Related Subjects

/204/
absorb
absorber
adjacent
adjacent thereto
co-sputter
conversion
efficiently
emittance
energy
energy conversion
etched
etched surface
etching
infrared
infrared region
maintained
material
method
minimal
photothermal
pre-selected
pre-selecting
predetermine
properties
reflectance
region
seed
seed material
selected temperature
solar
solar absorber
sputter
sputter etching
sunlight
surface
target
target surface
temperature
textured
thereto
thermal energy
well-suited