Method of sputter etching a surface

Patent · Sun Jan 01 00:00:00 EST 1984

OSTI ID:864875

Henager, Jr., Charles H. ^[1]

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1. (Seattle, WA)

The surface of a target is textured by co-sputter etching the target surface with a seed material adjacent thereto, while the target surface is maintained at a pre-selected temperature. By pre-selecting the temperature of the surface while sputter etching, it is possible to predetermine the reflectance properties of the etched surface. The surface may be textured to absorb sunlight efficiently and have minimal emittance in the infrared region so as to be well-suited for use as a solar absorber for photothermal energy conversion.

• Research Organization: Battelle Memorial Institute, Columbus, OH (United States)
• DOE Contract Number: AC06-76RL01830
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 4431499
• OSTI ID: 864875
• Country of Publication: United States
• Language: English

Related Subjects

method
sputter
etching
surface
target
textured
co-sputter
seed
material
adjacent
thereto
maintained
pre-selected
temperature
pre-selecting
predetermine
reflectance
properties
etched
absorb
sunlight
efficiently
minimal
emittance
infrared
region
well-suited
solar
absorber
photothermal
energy
conversion
adjacent thereto
thermal energy
energy conversion
target surface
selected temperature
seed material
solar absorber
etched surface
sputter etching
infrared region
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