Design specifications for manufacturability of MCM-C multichip modules
The scope of this document is to establish design guidelines for electronic circuitry packaged as multichip modules of the ceramic substrate variety, although many of these guidelines are applicable to other types of multichip modules. The guidelines begin with prerequisite information which must be developed between customer and designer of the multichip module. The core of the guidelines focuses on the many considerations that must be addressed during the multichip module design. The guidelines conclude with the resulting deliverables from the design which satisfy customer requirements and/or support the multichip module fabrication and testing processes. Considerable supporting information, checklists, and design constraints are captured in specific appendices and used as reference information in the main body text. Finally some real examples of multichip module design are presented.
- Research Organization:
- Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 83879
- Report Number(s):
- KCP--613-5430; ON: DE95014898
- Country of Publication:
- United States
- Language:
- English
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