Multichip module technology for automotive application
- Center for the Commercial Development of Space Power and Advanced Electronics, 231 Leach Center, Auburn University, Alabama 36849 (United States)
- Chrysler/Huntsville Electronics, 100 Electronics Blvd., Huntsville, Alabama 35824 (United States)
Advancements in multichip module technology are creating design freedoms previously unavailable to design engineers. These advancements are opening new markets for laminate based multichip module products. In particular, material improvements in laminate printed wiring boards are allowing multichip module technology to meet more stringent environmental conditions. In addition, improvements in encapsulants and adhesives are enhancing the capabilities of multichip module technology to meet harsh environment. Furthermore, improvements in manufacturing techniques are providing the reliability improvements necessary for use in high quality electronic systems. These advances are making multichip module technology viable for high volume, harsh environment applications like under-the-hood automotive electronics. This paper will provide a brief review of multichip module technology, a discussion of specific research activities with Chrysler for use of multichip modules in automotive engine controllers and finally a discussion of prototype multichip modules fabricated and tested. (AIP)
- Research Organization:
- Auburn Univ., AL (United States)
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 165144
- Journal Information:
- AIP Conference Proceedings, Albuquerque, NM (United States), 8-12 Jan 1995, Journal Name: AIP Conference Proceedings, Albuquerque, NM (United States), 8-12 Jan 1995 Journal Issue: 1 Vol. 325; ISSN 0094-243X; ISSN APCPCS
- Country of Publication:
- United States
- Language:
- English
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