Side wall roughness in ultradeep x-ray lithography.
Conference
·
OSTI ID:811297
No abstract prepared.
- Research Organization:
- Argonne National Lab., IL (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- W-31109-ENG-38
- OSTI ID:
- 811297
- Report Number(s):
- ANL/XFD/CP-105180
- Country of Publication:
- United States
- Language:
- English
Similar Records
Graphite-based x-ray masks for deep and ultradeep x-ray lithography.
Optimization of su-8 processing parameters for deep x-ray lithography.
Development of a freestanding copper antiscatter grid using deep x-ray lithography.
Journal Article
·
Mon Nov 30 23:00:00 EST 1998
· Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena
·
OSTI ID:15002998
Optimization of su-8 processing parameters for deep x-ray lithography.
Conference
·
Thu Jul 17 00:00:00 EDT 2003
·
OSTI ID:841207
Development of a freestanding copper antiscatter grid using deep x-ray lithography.
Conference
·
Thu Nov 13 23:00:00 EST 2003
·
OSTI ID:819440