A study of thermal cycling and radiation effects on indium and solder bump bonds

Conference · Tue Dec 11 04:00:00 EST 2001

OSTI ID:789479

Kwan, Simon ^[1]

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1. Fermilab

The BTeV hybrid pixel detector is constructed of readout chips and sensor arrays which are developed separately. The detector is assembled by flip-chip mating of the two parts. This method requires the availability of highly reliable, reasonably low cost fine-pitch flip-chip attachment technology. We have tested the quality of two bump-bonding technologies; indium bumps (by Advanced Interconnect Technology Ltd. (AIT) of Hong Kong) and fluxless solder bumps (by MCNC in North Carolina, USA). The results have been presented elsewhere [1]. In this paper we describe tests we performed to further evaluate these technologies. We subjected 15 indium bump-bonded and 15 fluxless solder bump-bonded dummy detectors through a thermal cycle and then a dose of radiation to observe the effects of cooling, heating and radiation on bump-bonds. We also exercised the processes of HDI mounting and wire bonding to some of the dummy detectors to see the effect of these processes on bump bonds.

• Research Organization: Fermi National Accelerator Lab., Batavia, IL (US)
• Sponsoring Organization: USDOE Office of Energy Research (ER) (US)
• DOE Contract Number: AC02-76CH03000
• OSTI ID: 789479
• Report Number(s): FERMILAB-Conf-01/377-E
• Country of Publication: United States
• Language: English

Related Subjects

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY
INDIUM
METALLURGICAL FLUX
MICROELECTRONIC CIRCUITS
PERFORMANCE TESTING
RADIATION DETECTORS
RADIATION EFFECTS
SOLDERED JOINTS
THERMAL CYCLING