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Observation of the instability of Ti[sub x]Ga[sub y] alloys with respect to GaAs at elevated temperatures

Journal Article · · Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States)
OSTI ID:7368869
;  [1]
  1. Stanford Univ., CA (United States)
The metallurgical reactions occurring at the Ti-GaAs interface between 600 and 850[degrees]C were examined using Auger depth profiling. Between 600 and 720[degrees]C titanium will react with gallium arsenide to form a uniform Ti[sub x]Ga[sub y]/TiAs/GaAs layered structure, similar to that which formed upon annealing Ti-GaAs contacts at much lower temperatures [J. Vac. Sci. Technol. A 5, 1511 (1987); J. Vac. Sci. Technol. A 6, 1473 (1988)]. However above 800[degrees]C the dominant reaction products are a titanium arsenide phase and liquid gallium. This result has significant implications for the development of thermally stable contacts to gallium arsenide using titanium-based metallizations. 14 refs., 2 figs.
OSTI ID:
7368869
Journal Information:
Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States), Journal Name: Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States) Vol. 10:6; ISSN 0734-211X; ISSN JVTBD9
Country of Publication:
United States
Language:
English