Multiple hybrid microcircuit processing. Final report
Efforts were undertaken to study and select fabrication methods suitable for processing multiple hybrid microcircuits (HMCs) on 3.75- by 4.5-in. (95 by 114 mm) substrates through thin-film metallization and photolithography. Each fabrication method studied was based on its potential for multiple hybrid microcircuit processing. Thin-film deposition parameters were analyzed in terms of thin-film properties necessary to meet HMC electrical and component attachment requirements, and photolithography parameters were analyzed in terms of dimensional requirements on the circuit pattern. The objective of this effort was met, and the techniques developed are being used successfully in the production of multiple HMCs.
- Research Organization:
- Bendix Corp., Kansas City, Mo. (USA)
- DOE Contract Number:
- AT(29-1)-613
- OSTI ID:
- 7352964
- Report Number(s):
- BDX-613-1383
- Country of Publication:
- United States
- Language:
- English
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