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Title: Chemically-trapped hydrogen in CVD Si/sub 3/N/sub 4/: dependence on NH/sub 3//SiH/sub 4/ ratio and on annealing. [H and D implants at 20 keV]

Conference ·
OSTI ID:7336783

Internal reflectance measurements were used to determine the hydrogen content in as-deposited, thermally annealed, and in hydrogen and deuterium implanted CVD silicon-nitride films. The deposition parameters were 700/sup 0/C, 150 A/min, argon carrier gas, and NH/sub 3//SiH/sub 4/ ratios of 10:1, 1000:1, and 1000:1. Hydrogen is bound both to nitrogen and to silicon. The NH band increases with the NH/sub 3//SiH/sub 4/ ratio, whereas the SiH band is a maximum in the 100:1 film. Conductance and refractive index of the films decrease with increasing NH/sub 3//SiH/sub 4/ ratio. Rapid initial annealing of the NH band is observed at 800/sup 0/C, whereas the SiH band intensity is maintained in 10:1 and 100:1 films but not in the 1000:1 film. This behavior is interpreted as a transfer of hydrogen from N to Si sites. It is suggested that the hydrogen content is hydrogen-limited in the 10:1 and 100:1 depositions and site-limited in the 1000:1 deposition. Hydrogen implantation provides a calibration which indicates approximately 7 at. percent hydrogen in the as-deposited 1000:1 film. Implanted deuterium gives the expected vibrational frequency shift for the absorption band but does not give a mass-dependent shift in annealing for the major loss stage near 900/sup 0/C, suggesting a bond-energy-limited rather than diffusion-limited hydrogen-loss mechanism. 10 fig.

Research Organization:
Sandia Labs., Albuquerque, NM (USA)
DOE Contract Number:
E(29-1)-789
OSTI ID:
7336783
Report Number(s):
SAND-76-5357; CONF-760851-1
Resource Relation:
Conference: IEEE non-volatile semiconductor memory workshop, Vail, CO, USA, 17 Aug 1976
Country of Publication:
United States
Language:
English