skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Atomic rearrangement at the interface of annealed ZnSe films grown on vicinal Si(001) substrates

Journal Article · · Physical Review, B: Condensed Matter; (United States)
; ; ; ; ;  [1];  [2]
  1. Xerox Palo Alto Research Center, 3333 Coyote Hill Road, Palo Alto, California 94304 (United States)
  2. National Center for Electron Microscopy, Materials Science Division, Lawrence Berkeley Laboratory, University of California, Berkeley, California 94720 (United States)

Significant atomic rearrangement at the interface was found to take place after post-growth annealing treatments of epitaxial ZnSe on As-passivated Si(001) substrates which were tilted by 4[degree] towards the [1[bar 1]0] direction. The thermal stability of the ZnSe/As:Si interface was studied by rapid thermal annealing at temperatures up to 960 [degree]C after growing an epitaxial GaAs cap layer to prevent evaporation of the ZnSe during the anneals. The ZnSe/As:Si interface was examined by high-resolution electron microscopy. After an anneal at 900 [degree]C the ZnSe/As:Si interface transformed from an atomically smooth interface found in the as-grown films to a facetted structure with [l brace]111[r brace]-oriented sidewalls that extended preferentially in the [1[bar 1]0] direction. The 60[degree] dislocations that were previously observed along this direc- tion combined into closely spaced pairs or into Lomer dislocations which were associated with the facets. We present a model for the atomic structure of the facetted interface which is consistent with the experimental data and satisfies electron-counting considerations. Total-energy calculations of the ZnSe/As:Si(001) interface were compared with those for the [l brace]111[r brace] interfaces seen after facetting.

DOE Contract Number:
AC03-76SF00098
OSTI ID:
7256402
Journal Information:
Physical Review, B: Condensed Matter; (United States), Vol. 50:7; ISSN 0163-1829
Country of Publication:
United States
Language:
English