Plasma-assisted chemical vapor deposition and characterization of boron nitride films
- IBM Microelectronics, Hopewell Junction, NY (United States)
- Siemens Components, Essex Junction, VT (United States)
- Siemens AG, Muenchen (Germany)
Boron nitride films were deposited in a single-wafer plasma enhanced chemical vapor deposition (PECVD) system using two different reactant gas chemistries: (1) dilute diborane (1% B[sub 2]H[sub 6] in nitrogen), nitrogen and ammonia; (2) borazine (B[sub 3]N[sub 3]H[sub 6]), and nitrogen as precursor materials. Variations of deposition rates, thickness uniformities, refractive indexes, wet and plasma dry etch rates, film stress, and electrical properties were studied as a function of the corresponding deposition parameters. Several analytical methods such as Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, nuclear reaction analysis, elastic recoil detection analysis, scanning and transmission electron microscopy were used to study the deposited films. Electrical properties were measured using metal-insulator-metal and metal-insulator-semiconductor structures. The stable boron nitride films do not react with water vapor showing dielectric constant values between 4.0 and 4.7. These good insulators also show promising characteristics for potential applications in high-performance ultralarge scale integration fabrication.
- OSTI ID:
- 7248325
- Journal Information:
- Journal of the Electrochemical Society; (United States), Journal Name: Journal of the Electrochemical Society; (United States) Vol. 141:6; ISSN JESOAN; ISSN 0013-4651
- Country of Publication:
- United States
- Language:
- English
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AZINES
BORANES
BORON COMPOUNDS
BORON NITRIDES
CHEMICAL COATING
CHEMICAL VAPOR DEPOSITION
COATINGS
DATA
DEPOSITION
ELECTRICAL PROPERTIES
EXPERIMENTAL DATA
HETEROCYCLIC COMPOUNDS
HYDRIDES
HYDROGEN COMPOUNDS
INFORMATION
NITRIDES
NITROGEN COMPOUNDS
NUMERICAL DATA
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
PHYSICAL PROPERTIES
PNICTIDES
STRUCTURAL CHEMICAL ANALYSIS
SURFACE COATING
VAPOR DEPOSITED COATINGS