Laser ablative fluxless soldering (LAFS): 60Sn-40Pb solder wettability tests on laser cleaned OFHC copper substrates
Conference
·
OSTI ID:721592
OFHC copper substrates, cleaned by laser ablation under argon and helium gas, were tested for solder wettability by 60Sn-40Pb using an area-of-spread method. The wettability of copper surfaces cleaned under both argon and helium gas was found to equal or exceed the wettability obtained on this surface in air using a standard RMA flux. The area of spread on copper substrates cleaned under helium was eight times larger than the area of spread of substrates cleaned under argon. The enhanced spreading observed on the substrates cleaned under helium gas was found to be due to surface roughness. 11 refs., 8 figs., 2 tabs.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 721592
- Report Number(s):
- SAND--91-1670C; CONF-9109259--10; ON: TI92020150
- Country of Publication:
- United States
- Language:
- English
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