Solderability of Kovar[trademark]
The wettability of bare Kovar by liquid 60Sn-40Pb solder was examined as a function of two surface preparation techniques. Adequate solderability was achieved with four organic acid fluxes when the Kovar surfaces were chemically etched in an acid solution; however, wetting was poor with the use of a rosin-based, mildly activated (RMA) flux. Changing to an electropolishing treatment with an acetic acid/perchloric acid electrolyte improved solder wetting, particularly with the RMA flux. Growth of the solder-substrate metallurgical reaction layer was examined after elevated-temperature annealing treatments. Intermetallic compounds grew both along the solder-substrate interface as well as in the solder phases, at rates much less than observed for the copper-solder system.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- DOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 6924626
- Report Number(s):
- SAND-92-0400C; CONF-9211132--1; ON: DE93004067
- Country of Publication:
- United States
- Language:
- English
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Solderability testing of Kovar with 60Sn40Pb solder and organic fluxes
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Related Subjects
360101* -- Metals & Alloys-- Preparation & Fabrication
ALLOYS
COBALT ALLOYS
ELECTROLYSIS
ELECTROPOLISHING
FABRICATION
INTERMETALLIC COMPOUNDS
IRON ALLOYS
IRON BASE ALLOYS
JOINING
KOVAR
LEAD ALLOYS
LYSIS
MANGANESE ADDITIONS
MANGANESE ALLOYS
METALLURGICAL FLUX
NICKEL ALLOYS
POLISHING
SOLDERING
SURFACE FINISHING
TIN ALLOYS
WELDING
WETTABILITY