Analysis of the reaction between 60Sn-40Pb solder with a Pd-Pt-Ag-Cu-Au alloy

Journal Article · Sun Jan 31 23:00:00 EST 1993 · Journal of Electronic Materials (A.I.M.E. Metallurgical Society); (United States)

DOI:https://doi.org/10.1007/BF02665025· OSTI ID:6222479

Frear, D R; Michael, J R; Hlava, P F ^[1]

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1. Sandia National Lab., Albuquerque, NM (United States)

We present the results of a metallurgical study of a 35Pd-30Ag-14Cu-10Au10Pt-1Zn (wt. %) alloy soldered with 60Sn-40Pb for glass-to-metal sealing applications. Mechanical tests were performed on the Pd-Ag-Cu-Au-Pt-Zn alloy and showed that it retains ductility, with an increase in strength, after heat treatments that simulate the glass-to-metal sealing temperature profile. Wetting characteristics of the alloy with 60Sn-40Pb solder were found to be adequate for pin joining applications. The formation and growth of the interfacial intermetallic between 60Sn-40Pb and the Pd-Ag-Cu-Au-Pt-Zn alloy were characterized. The matrix of the intermetallic layer consists of PdSn[sub 4] with platinum and gold substituting for the palladium in the crystal structure. Also present were precipitates of Cu[sub 3]Sn and Ag[sub 3]Sn. Nano-indentation hardness tests showed that the intermetallic layer has mechanical properties similar to the base metal while retaining good ductility. The intermetallic was also found to have good wettability under solder reflow conditions. We conclude from these tests that the Pd-Ag-Cu-Au-Pt-Zn alloy is a suitable option as a pin material for glass-to-metal sealing applications. 20 refs., 11 figs., 3 tabs.

• DOE Contract Number: AC04-76DP00789
• OSTI ID: 6222479
• Journal Information: Journal of Electronic Materials (A.I.M.E. Metallurgical Society); (United States), Journal Name: Journal of Electronic Materials (A.I.M.E. Metallurgical Society); (United States) Vol. 22:2; ISSN JECMA5; ISSN 0361-5235
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360103* -- Metals & Alloys-- Mechanical Properties
360104 -- Metals & Alloys-- Physical Properties
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
400201 -- Chemical & Physicochemical Properties
ALLOYS
CHEMICAL REACTIONS
COPPER ALLOYS
ELECTRON MICROSCOPY
ELECTRONIC EQUIPMENT
EQUIPMENT
FABRICATION
GLASS
GOLD ALLOYS
INTERMETALLIC COMPOUNDS
JOINING
MATERIALS
MATERIALS TESTING
MECHANICAL PROPERTIES
MECHANICAL TESTS
MICROSCOPY
PACKAGING
PALLADIUM ALLOYS
PLATINUM ALLOYS
PLATINUM METAL ALLOYS
SEALING MATERIALS
SILVER ALLOYS
SOLDERING
TESTING
TRANSMISSION ELECTRON MICROSCOPY
WELDING
WETTABILITY