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Viscous shear flow model for MOS device radiation sensitivity

Conference · · IEEE Trans. Nucl. Sci.; (United States)
OSTI ID:7213063
A model is presented which relates MOS processing steps and design parameters to the ionizing radiation sensitivity of hardened MOS devices. The model is based on combining the viscous properties of SiO/sub 2/ at typical processing temperatures with stresses arising in the SiO/sub 2/ on Si system during oxidation and subsequent high-temperature cycles. The model explains the recently observed dependence of radiation-induced flatband voltage shifts upon SiO/sub 2/ thickness cubed. Quantitative comparison with experiment is obtained for the relations of flatband voltage shift on post-oxidation annealing temperature and on oxide growth temperature. Several processing changes to further harden both dry and wet oxides are suggested by the model.
Research Organization:
Sandia Labs., Albuquerque, NM
OSTI ID:
7213063
Conference Information:
Journal Name: IEEE Trans. Nucl. Sci.; (United States) Journal Volume: NS-23:6
Country of Publication:
United States
Language:
English