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Enhancement of deposition rate by adding Si sub 2 F sub 6 in low-pressure chemical vapor deposition of W using WF sub 6 and H sub 2

Journal Article · · Journal of Applied Physics; (USA)
DOI:https://doi.org/10.1063/1.345730· OSTI ID:7171973
; ;  [1]
  1. Semiconductor Technology Laboratory, OKI Electric Industry Co., Ltd., 550-5, Higashiasakawa-cho, Hachioji-shi, Tokyo 193, Japan (JP)

The effects of addition of Si{sub 2}F{sub 6} to low-pressure chemical vapor deposition of W using WF{sub 6} and H{sub 2} was studied. Adding sufficient Si{sub 2}F{sub 6} gas enhances the deposition rate ({ital R}{sub {ital D}}) of W film in the WF{sub 6} and H{sub 2} system by a factor of 2 over a wide range of deposition parameters, that is, the substrate temperature and the partial pressures of H{sub 2}, WF{sub 6}, and Si{sub 2} F{sub 6}. W films deposited under the conditions where the enhancement of {ital R}{sub {ital D}} occurs have a resistivity as low as that of films deposited in the WF{sub 6} and H{sub 2} system, except for some W films exhibiting {beta}-W structure, and have no Si contamination. The origin of the enhancement of {ital R}{sub {ital D}} by adding Si{sub 2}F{sub 6} is discussed.

OSTI ID:
7171973
Journal Information:
Journal of Applied Physics; (USA), Journal Name: Journal of Applied Physics; (USA) Vol. 67:2; ISSN 0021-8979; ISSN JAPIA
Country of Publication:
United States
Language:
English