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Radiation-induced charge neutralization and interface-trap buildup in metal-oxide-semiconductor devices

Journal Article · · Journal of Applied Physics; (USA)
DOI:https://doi.org/10.1063/1.345199· OSTI ID:7170220
 [1]
  1. Sandia National Laboratories, Albuquerque, New Mexico 87185-5800 (US)

Effects of switched bias on the radiation response of metal-oxide-semiconductor (MOS) devices have been investigated. Transistors with 50-nm gate oxides were irradiated at +10-V bias to create a large trapped-hole density in the oxide. Irradiation was continued under varying negative and positive biases. Very little radiation-induced charge neutralization is observed at biases {lt}{minus}10 V for these devices. However, significant trapped-hole neutralization is observed at biases from {minus}10 to 0 V, with a broad maximum in neutralization rate from {minus}6 to {minus}1 V. The peak charge neutralization rate is approximately equal to the rate of trapped-hole buildup under positive bias. This establishes an upper bound on the rate of radiation-induced charge neutralization, and demonstrates that, under peak neutralization conditions, the effective cross section for the capture of radiation-induced electrons by a filled hole trap is similar to the effective cross section for capture of a hole by an empty trap. Interface traps are found to build up at approximately the same rate when the oxide electric field at the Si/SiO{sub 2} interface is positive, regardless of the field direction in the bulk of the oxide. This suggests that near-interfacial hydrogen may play a key role in interface-trap buildup in MOS devices.

DOE Contract Number:
AC04-76DP00789
OSTI ID:
7170220
Journal Information:
Journal of Applied Physics; (USA), Journal Name: Journal of Applied Physics; (USA) Vol. 67:1; ISSN 0021-8979; ISSN JAPIA
Country of Publication:
United States
Language:
English