Tungsten and other refractory metals for VLSI applications II
Conference
·
OSTI ID:7167774
This book presents papers on tungsten and other refractory metals for VLSI applications. Topics include the following: Selectivity loss and nucleation on insulators, fundamental reaction and growth studies, chemical vapor deposition of tungsten, chemical vapor deposition of molybdenum, reactive ion etching of refractory metal films; and properties of refractory metals deposited by sputtering.
- OSTI ID:
- 7167774
- Report Number(s):
- CONF-8611130-
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
360200 -- Ceramics
Cermets
& Refractories
42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ABSTRACTS
CHEMICAL COATING
CHEMICAL VAPOR DEPOSITION
DEPOSITION
DOCUMENT TYPES
ELECTRONIC CIRCUITS
ELEMENTS
ETCHING
FILMS
INTEGRATED CIRCUITS
LEADING ABSTRACT
MEETINGS
METALS
MICROELECTRONIC CIRCUITS
NUCLEATION
SPUTTERING
SURFACE COATING
SURFACE FINISHING
THIN FILMS
TRANSITION ELEMENTS
TUNGSTEN
360200 -- Ceramics
Cermets
& Refractories
42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ABSTRACTS
CHEMICAL COATING
CHEMICAL VAPOR DEPOSITION
DEPOSITION
DOCUMENT TYPES
ELECTRONIC CIRCUITS
ELEMENTS
ETCHING
FILMS
INTEGRATED CIRCUITS
LEADING ABSTRACT
MEETINGS
METALS
MICROELECTRONIC CIRCUITS
NUCLEATION
SPUTTERING
SURFACE COATING
SURFACE FINISHING
THIN FILMS
TRANSITION ELEMENTS
TUNGSTEN