Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Development of novel fabrication techniques for a silicon micro-vertex detector unit using the flip-chip bonding method

Conference · · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States)
OSTI ID:7154894
Full-size models of a detector unit for a silicon microvertex detector were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film (ACF) was examined. The structure using the new type ACF and improved fabrication process provide a sufficient electrical connection and good reliability for the detector unit.
OSTI ID:
7154894
Report Number(s):
CONF-931051--
Conference Information:
Journal Name: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States) Journal Volume: 41:4Pt1
Country of Publication:
United States
Language:
English