Development of novel fabrication techniques for a silicon micro-vertex detector unit using the flip-chip bonding method
Conference
·
· IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States)
OSTI ID:7154894
- and others
Full-size models of a detector unit for a silicon microvertex detector were built for the KEK B factory. The Flip-Chip Bonding (FCB) method using a new type anisotropic conductive film (ACF) was examined. The structure using the new type ACF and improved fabrication process provide a sufficient electrical connection and good reliability for the detector unit.
- OSTI ID:
- 7154894
- Report Number(s):
- CONF-931051--
- Conference Information:
- Journal Name: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States) Journal Volume: 41:4Pt1
- Country of Publication:
- United States
- Language:
- English
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440104* -- Radiation Instrumentation-- High Energy Physics Instrumentation
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY
ACCELERATORS
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INTEGRATED CIRCUITS
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MESON FACTORIES
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430303 -- Particle Accelerators-- Experimental Facilities & Equipment
440104* -- Radiation Instrumentation-- High Energy Physics Instrumentation
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY
ACCELERATORS
ELECTRONIC CIRCUITS
FABRICATION
INTEGRATED CIRCUITS
MEASURING INSTRUMENTS
MESON FACTORIES
MICROELECTRONIC CIRCUITS
PARTICLE TRACKS
RADIATION DETECTORS
SEMICONDUCTOR DETECTORS
SI SEMICONDUCTOR DETECTORS
STRUCTURAL MODELS