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Development of novel architecture and assembly techniques for a detector unit for a silicon micro-vertex detector using the flip-chip bonding method

Conference · · IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States)
OSTI ID:5946278
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  1. KEK, National Lab. for High Energy Physics, Tsukuba, Ibaraki (Japan)
  2. Osaka Univ., Toyonaka (Japan). Dept. of Physics
  3. Tsukuba Univ., Sakura (Japan). Inst. of Applied Physics
The authors built full-size models of a detector unit for a silicon micro-vertex detector for the KEK B factory. The model consists of four dummy double-sided, double-metal silicon micro-strip detectors and two silicon end boards with dummy readout VLSIs mounted on both sides. In this trial the Flip-Chip Bonding (FCB) method, using an anisotropic conductive film is applied to both sides of the detector unit to bond 640 strips at a pitch of 50 [mu]m. The structure using the FCB method successfully provides a new architecture for the detector unit of a vertex detector.
OSTI ID:
5946278
Report Number(s):
CONF-921005--
Conference Information:
Journal Name: IEEE Transactions on Nuclear Science (Institute of Electrical and Electronics Engineers); (United States) Journal Volume: 40:4 part 1
Country of Publication:
United States
Language:
English

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