Metalization of lipid vesicles via electroless plating
Journal Article
·
· J. Am. Chem. Soc.; (United States)
The encapsulation of metallic particles and metallic oxides within lipid vesicles has recently been of interest for applications such as catalysis, water splitting, and magnetic control of spin coupling. In this communication the authors introduce the concept and practice of the deposition of metal on vesicles by using electroless plating techniques. Coordination of low valent transition metals to organic functional groups on the surface of the bilayer membrane provides a means of binding metal atoms to vesicles. Chemical reduction produced zero valent atoms which serve as sites for further metal deposition by the chemical reduction techniques of electroless plating. Specifically, this procedure involved the binding of a small amount of tetrachloropalladate to the vesicle bilayer, reduction of the palladium(II) to palladium(0), followed by the deposition of much larger amounts of metal from an electroless plating solution. Electroless plating solutions were used for the deposition of palladium, nickel, cobalt, or copper metal onto the catalytic palladium centers. Since the metallic particles were associated with the vesicles, colloids were formed that were stable in water for much longer periods than the control metal particles formed in water alone. If the vesicles were composed in part of unsaturated lipids, with the olefinic groups on the hydrocarbon chains, the initial evidence suggests the transition metal was directed into the bilayer, rather than staying on the surface.
- Research Organization:
- Eastman Kodak Company, Rochester, NY (USA)
- OSTI ID:
- 7148491
- Journal Information:
- J. Am. Chem. Soc.; (United States), Journal Name: J. Am. Chem. Soc.; (United States) Vol. 110:1; ISSN JACSA
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
08 HYDROGEN
080101 -- Hydrogen-- Production-- Electrolysis
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
400201* -- Chemical & Physicochemical Properties
COBALT
COPPER
DATA
DEPOSITION
ELECTRODEPOSITION
ELECTROLYSIS
ELECTRON MICROSCOPY
ELECTROPLATING
ELEMENTS
EXPERIMENTAL DATA
INFORMATION
LIPIDS
LYSIS
METALS
MICROSCOPY
NICKEL
NUMERICAL DATA
ORGANIC COMPOUNDS
PALLADIUM
PLATING
PLATINUM METALS
SURFACE COATING
TRANSITION ELEMENTS
080101 -- Hydrogen-- Production-- Electrolysis
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
400201* -- Chemical & Physicochemical Properties
COBALT
COPPER
DATA
DEPOSITION
ELECTRODEPOSITION
ELECTROLYSIS
ELECTRON MICROSCOPY
ELECTROPLATING
ELEMENTS
EXPERIMENTAL DATA
INFORMATION
LIPIDS
LYSIS
METALS
MICROSCOPY
NICKEL
NUMERICAL DATA
ORGANIC COMPOUNDS
PALLADIUM
PLATING
PLATINUM METALS
SURFACE COATING
TRANSITION ELEMENTS