Development of the Diffusion Bonding Process

Technical Report · Wed Feb 25 00:00:00 EST 1987

DOI:https://doi.org/10.2172/7048303· OSTI ID:7048303

Kwiatkowski, J. ^[1]; Jones, William H. ^[1]

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1. Mound Plant (MOUND), Miamisburg, OH (United States)

The diffusion bonding process was adapted for a unique low-temperature application involving the attachment of thin copper materials used in the flexible printed circuit industry. The work completed to date has demonstrated the feasibility of welding 0.0002-in. thick copper foil to 0.0014-in. thick oxygen-free, high-conductivity (OFHC) copper sheeting. The 0.0002-in. foil is an electrodeposited material on a Kapton substrate. The 0.0014-in. copper sheet is part of a cable assembly consisting of Kapton, epoxy, Pyralux adhesive, and additional copper layers. Heat must be applied through all these materials to effect welding at the interface. Diffusion bonding parameters of 5000 psi, a 3-min time period, and a weld interface temperature of 288°C (550°F) were found to form effective welds without causing appreciable degradation of the assembly, as shown by high voltage breakdown testing.

• Research Organization: Mound Plant (MOUND), Miamisburg, OH (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC04-76DP00053
• OSTI ID: 7048303
• Report Number(s): MLM--3418; ON: DE87006598
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
42 ENGINEERING
420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
COPPER
DIFFUSION WELDING
ELECTRONIC CIRCUITS
ELEMENTS
FABRICATION
FOILS
JOINING
METALS
NESDPS Office of Nuclear Energy Space and Defense Power Systems
PRINTED CIRCUITS
SHEETS
TRANSITION ELEMENTS
WELDING