Design and fabrication of an integrated bonding system for tape processing of slapper detonator cables
Technical Report
·
OSTI ID:5262874
A unique bonding system was designed and built as an addition to the other reel-to-reel processing equipment in the Tape Process Laboratory at Mound. This bonder supports an in-house flexible circuit manufacturing capability which has been established by Mound's Tape Processing Group. This bonder, like most of the equipment in the Tape Process Laboratory, was designed and built to Mound's specifications. This bonding system integrates into one machine all operations necessary to prepare, bond, and test the joint between a flexible printed circuit cable and an etched (copper/Kapton) bridge. Design specifications were established for all operations (cable cleaning, assembly, bonding, resistance testing, vacuum stress test, and closed circuit TV inspection). The design concepts used for the design of the Integrated Bonding System provided for the bonding of different detonator cables and bridge designs with minimal tooling changes. 16 figs.
- Research Organization:
- Monsanto Research Corp., Miamisburg, OH (USA). Mound
- DOE Contract Number:
- AC04-76DP00053
- OSTI ID:
- 5262874
- Report Number(s):
- MLM-3374; ON: DE87000333
- Country of Publication:
- United States
- Language:
- English
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