MC3121 cable-to-header bond-failure study

Conference · Thu Jan 01 04:00:00 EST 1981

OSTI ID:5954668

Dichiaro, J V; Salerno, R F; Schneider, R E

MC3121 detonators employ a film adhesive to join polyimideclad electrical cables to ceramic detonator headers. The film adhesive, a modified acrylic, provides support for the cable-to-heat weld junctures and also acts as a dielectric medium between the junctures. Following a successful development bonding program, gross bonding failures were suddenly observed in the fabrication of the environmental/qualification lot. The affected assemblies exhibited a significantly reduced peel strength and a failure mode that was exclusively interfacial at the polyimide-adhesive interface. Normally, a mixed failure mode is observed showing some degree of polyimide delamination from the cable. This nonbonding condition was determined to arise from surface contamination on the polyimide-clade electrical cables and was eliminated by plasma cleaning techniques. A grit-blasted polyimide surface was found to be less desirable than an untreated surface, as it acts as a contaminant sponge.

• Research Organization: Mound Facility, Miamisburg, OH (USA)
• DOE Contract Number: AC04-76DP00053
• OSTI ID: 5954668
• Report Number(s): MLM-2879-OP; CONF-811076-6; ON: DE82003032
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420200 -- Engineering-- Facilities
Equipment
& Techniques
45 MILITARY TECHNOLOGY, WEAPONRY, AND NATIONAL DEFENSE
450100* -- Military Technology
Weaponry
& National Defense-- Chemical Explosions & Explosives
ADHESIVES
BONDING
CABLES
CERAMICS
CLEANING
CONDUCTOR DEVICES
DATA
DETONATORS
ELECTRIC CABLES
ELECTRICAL EQUIPMENT
EQUIPMENT
EXPERIMENTAL DATA
FABRICATION
FAILURES
INFORMATION
JOINING
JOINTS
NUMERICAL DATA
POLYMERS
SURFACE CLEANING
SURFACE FINISHING