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CH sub 4 /H sub 2 reactive ion etching for gate recessing of pseudomorphic modulation doped field effect transistors

Journal Article · · Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States)
OSTI ID:7047972

Pseudomorphic AlGaAs/InGaAs modulation doped field effect transistors have been fabricated by using methane/hydrogen (CH{sub 4}/H{sub 2}) reactive ion etching for gate recessing. Source-drain resistance and Hall measurements on as etched and annealed samples are presented. The electrical degradation introduced by the plasma can be recovered after annealing at 400C. A threshold voltage (V{sub th}) standard deviation of 14 mV over a 5 cm (2 in.) wafer was obtained.

OSTI ID:
7047972
Journal Information:
Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States), Journal Name: Journal of Vacuum Science and Technology. B, Microelectronics Processing and Phenomena; (United States) Vol. 9:4; ISSN 0734-211X; ISSN JVTBD
Country of Publication:
United States
Language:
English