Potential applications of an electron cyclotron resonance multicusp plasma source

Journal Article · Tue May 01 00:00:00 EDT 1990 · Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (USA)

DOI:https://doi.org/10.1116/1.576646· OSTI ID:7040349

Tsai, C C; Berry, L A; Gorbatkin, S M; Haselton, H H; Roberto, J B; Stirling, W L ^[1]

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1. Oak Ridge National Laboratory, Oak Ridge, TN (USA)

An electron cyclotron resonance (ECR) multicusp plasmatron has been developed by feeding a multicusp bucket arc chamber with a compact ECR plasma source. This novel source produces large (about 25 cm diam), uniform (to within {plus minus}10%), dense ({gt}10{sup 11} cm{sup {minus}3}) plasmas of argon, helium, hydrogen, and oxygen. It has been operated to produce an oxygen plasma for etching 12.7 cm (5 in.) positive photoresist-coated silicon wafers with uniformity within {plus minus}8%. Results and potential applications of this new ECR plasma source for plasma processing of thin films are discussed.

• DOE Contract Number: AC05-84OR21400
• OSTI ID: 7040349
• Journal Information: Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (USA), Vol. 8:3; ISSN 0734-2101
• Country of Publication: United States
• Language: English

Related Subjects

71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
ION SOURCES
USES
CURRENT DENSITY
ELECTRON TEMPERATURE
ETCHING
SURFACE FINISHING
640301* - Atomic
Molecular & Chemical Physics- Beams & their Reactions