Thermal Analysis of a SHIELD Electromigration Test Structure
- Sandia National Laboratories
The steady state and transient thermal behavior of an electromigration test structure was analyzed. The test structure was a Sandia SHIELD (Self-stressing HIgh fregquency rELiability Device) electromigration test device manufactured by an outside vendor. This device has a high frequency oscillator circuit, a buffer circuit to isolate and drive the metal line to the tested (DUT), the DUT to be electromigrated itself, a metal resistance thermometry monitor, and a heater elment to temperature accelerate the electromigration effect.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 7021
- Report Number(s):
- SAND99-1171; ON: DE00007021
- Country of Publication:
- United States
- Language:
- English
Similar Records
LCP heater thermal performance test results and unique test techniques
Electromigration tests on Sandia integrated circuits
Electromigration in metallic systems
Conference
·
Mon Dec 31 23:00:00 EST 1979
·
OSTI ID:5135717
Electromigration tests on Sandia integrated circuits
Technical Report
·
Mon Feb 28 23:00:00 EST 1983
·
OSTI ID:6443327
Electromigration in metallic systems
Conference
·
Tue May 29 00:00:00 EDT 1973
·
OSTI ID:4340885