Direct write with microelectronic circuit fabrication
Patent
·
OSTI ID:6976416
This patent describes a process for forming a pattern on a substrate by deposition of a material. It comprises depositing a suspension of colloidal particles of the material in a solvent on to a substrate by ink jet printing; evaporating the solvent, the material remaining on the substrate; laser annealing the deposited material to the substrate, the pattern being defined by the path of the laser beam; and removing excess material not annealed by the laser beam.
- Assignee:
- US Dept. of Energy, Washington, DC (United States)
- Patent Number(s):
- US 5132248; A
- Application Number:
- PPN: US 7-200096; TRN: 92-033628
- OSTI ID:
- 6976416
- Resource Relation:
- Patent File Date: 31 May 1988
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
42 ENGINEERING
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
MATERIALS
LASER-RADIATION HEATING
MICROELECTRONIC CIRCUITS
FABRICATION
BEAM OPTICS
COLLOIDS
EVAPORATION
SOLVENTS
SUBSTRATES
DISPERSIONS
ELECTRONIC CIRCUITS
HEATING
PHASE TRANSFORMATIONS
PLASMA HEATING
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)
665300 - Interactions Between Beams & Condensed Matter- (1992-)
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
MATERIALS
LASER-RADIATION HEATING
MICROELECTRONIC CIRCUITS
FABRICATION
BEAM OPTICS
COLLOIDS
EVAPORATION
SOLVENTS
SUBSTRATES
DISPERSIONS
ELECTRONIC CIRCUITS
HEATING
PHASE TRANSFORMATIONS
PLASMA HEATING
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)
665300 - Interactions Between Beams & Condensed Matter- (1992-)