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Title: Direct write with microelectronic circuit fabrication

Patent ·
OSTI ID:6976416

This patent describes a process for forming a pattern on a substrate by deposition of a material. It comprises depositing a suspension of colloidal particles of the material in a solvent on to a substrate by ink jet printing; evaporating the solvent, the material remaining on the substrate; laser annealing the deposited material to the substrate, the pattern being defined by the path of the laser beam; and removing excess material not annealed by the laser beam.

Assignee:
US Dept. of Energy, Washington, DC (United States)
Patent Number(s):
US 5132248; A
Application Number:
PPN: US 7-200096; TRN: 92-033628
OSTI ID:
6976416
Resource Relation:
Patent File Date: 31 May 1988
Country of Publication:
United States
Language:
English