Direct write with microelectronic circuit fabrication

Title: Direct write with microelectronic circuit fabrication

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Abstract

In a process for deposition of material onto a substrate, for example, the deposition of metals or dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit.

Inventors:

Drummond, Timothy ^[1]; Ginley, David ^[2]

Ann Arbor, MI
Albuquerque, NM

Publication Date:: 1992-01-01

Research Org.:: AT&T

OSTI Identifier:: 868399

Patent Number(s):: US 5132248

Assignee:: United States of America as represented by United States (Washington, DC)

DOE Contract Number:: AC04-76DP00789

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: direct; write; microelectronic; circuit; fabrication; process; deposition; material; substrate; example; metals; dielectrics; semiconductor; laser; deposited; providing; colloidal; suspension; directly; writing; surface; jet; printing; techniques; procedure; minimizes; handling; requirements; exchange; energy; interface; resolved; desired; pattern; preferably; subjecting; deposit; annealing; step; provides; resolution; resultant; minimizing; overall; thermal; load; permitting; precise; control; chemistry; interdiffusion; circuit fabrication; precise control; laser annealing; semiconductor laser; electronic circuit; substrate surface; deposition process; deposited material; colloidal suspension; annealing step; desired pattern; overall thermal; thermal load; microelectronic circuit; printing techniques; direct write; /505/347/427/438/

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                    Drummond, Timothy, and Ginley, David. Direct write with microelectronic circuit fabrication.  United States: N. p., 1992. 
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                    Drummond, Timothy, & Ginley, David. Direct write with microelectronic circuit fabrication.  United States.

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                    Drummond, Timothy, and Ginley, David. Wed .  
        "Direct write with microelectronic circuit fabrication".  United States.  https://www.osti.gov/servlets/purl/868399.

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@article{osti_868399,

  title        = {Direct write with microelectronic circuit fabrication},

  author       = {Drummond, Timothy and Ginley, David},

  abstractNote = {In a process for deposition of material onto a substrate, for example, the deposition of metals or dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit.},

  doi          = {},

  url          = {https://www.osti.gov/biblio/868399},
  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1992},

  month        = {1}

}

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