Direct write with microelectronic circuit fabrication
- Ann Arbor, MI
- Albuquerque, NM
In a process for deposition of material onto a substrate, for example, the deposition of metals or dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit.
- Research Organization:
- AT & T CORP
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Number(s):
- US 5132248
- OSTI ID:
- 868399
- Country of Publication:
- United States
- Language:
- English
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journal | November 1985 |
Laser-Enhanced Plating and Etching: Mechanisms and Applications
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journal | March 1982 |
Patterned aluminum growth via excimer laser activated metalorganic chemical vapor deposition
|
journal | April 1986 |
High speed precision X-Y stage
|
journal | January 1985 |
Laser chemical vapor deposition of gold
|
journal | September 1985 |
Recent Advances in Laser-Enhanced Plating
|
journal | January 1983 |
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Direct write with microelectronic circuit fabrication
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Related Subjects
annealing
annealing step
chemistry
circuit
circuit fabrication
colloidal
colloidal suspension
control
deposit
deposited
deposited material
deposition
deposition process
desired
desired pattern
dielectrics
direct
direct write
directly
electronic circuit
energy
example
exchange
fabrication
handling
interdiffusion
interface
jet
laser
laser annealing
load
material
metals
microelectronic
microelectronic circuit
minimizes
minimizing
overall
overall thermal
pattern
permitting
precise
precise control
preferably
printing
printing techniques
procedure
process
provides
providing
requirements
resolution
resolved
resultant
semiconductor
semiconductor laser
step
subjecting
substrate
substrate surface
surface
suspension
techniques
thermal
thermal load
write
writing