Direct write with microelectronic circuit fabrication

Patent · Tue May 31 04:00:00 EDT 1988

OSTI ID:6157870

Drummond, T.; Ginley, D.

In a process for deposition of material onto a substrate, for example, the deposition of metals for dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit. 3 figs.

• Research Organization: Sandia National Labs., Albuquerque, NM (USA)
• DOE Contract Number: AC04-76DP00789
• Assignee: Dept. of Energy
• Patent Number(s): PATENTS-US-A7200096
• Application Number: ON: DE89009660
• OSTI ID: 6157870
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360601 -- Other Materials-- Preparation & Manufacture
42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
DEPOSITION
DESIGN
ELECTRONIC CIRCUITS
FABRICATION
INVENTIONS
MICROELECTRONIC CIRCUITS
MICROELECTRONICS
SUBSTRATES