Direct write with microelectronic circuit fabrication

Title: Direct write with microelectronic circuit fabrication

Full Record
Other Related Research

Abstract

In a process for deposition of material onto a substrate, for example, the deposition of metals for dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit. 3 figs.

Inventors:: Drummond, T.; Ginley, D.

Publication Date:: 1988-05-31

Research Org.:: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)

OSTI Identifier:: 6157870

Patent Number(s):: PATENTS-US-A7200096

Application Number:: ON: DE89009660

Assignee:: Dept. of Energy

DOE Contract Number:: AC04-76DP00789

Resource Type:: Patent

Resource Relation:: Other Information: Portions of this document are illegible in microfiche products

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; 36 MATERIALS SCIENCE; MICROELECTRONIC CIRCUITS; FABRICATION; DEPOSITION; DESIGN; INVENTIONS; MICROELECTRONICS; SUBSTRATES; ELECTRONIC CIRCUITS; 420800* - Engineering- Electronic Circuits & Devices- (-1989); 360601 - Other Materials- Preparation & Manufacture

Citation Formats


                    Drummond, T., and Ginley, D. Direct write with microelectronic circuit fabrication.  United States: N. p., 1988. 
        Web.

Copy to clipboard


                    Drummond, T., & Ginley, D. Direct write with microelectronic circuit fabrication.  United States.

Copy to clipboard


                    Drummond, T., and Ginley, D. Tue .  
        "Direct write with microelectronic circuit fabrication".  United States.  https://www.osti.gov/servlets/purl/6157870.

Copy to clipboard


                    
@article{osti_6157870,

  title        = {Direct write with microelectronic circuit fabrication},

  author       = {Drummond, T. and Ginley, D.},

  abstractNote = {In a process for deposition of material onto a substrate, for example, the deposition of metals for dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit. 3 figs.},

  doi          = {},

  url          = {https://www.osti.gov/biblio/6157870},
  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1988},

  month        = {5}

}

Copy to clipboard

Patent:

View Patent (1.37 MB)

Save / Share:

Export Metadata

Save to My Library

Similar records in OSTI.GOV collections:

Direct write with microelectronic circuit fabrication

Patent Drummond, Timothy ; Ginley, David

In a process for deposition of material onto a substrate, for example, the deposition of metals or dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step.more »« less
Full Text Available
Direct write with microelectronic circuit fabrication

Patent Drummond, T ; Ginley, D

This patent describes a process for forming a pattern on a substrate by deposition of a material. It comprises depositing a suspension of colloidal particles of the material in a solvent on to a substrate by ink jet printing; evaporating the solvent, the material remaining on the substrate; laser annealing the deposited material to the substrate, the pattern being defined by the path of the laser beam; and removing excess material not annealed by the laser beam.
Direct Writing of Additive-Free MXene-in-Water Ink for Electronics and Energy Storage

Journal Article Quain, Evan ; Mathis, Tyler S. ; Kurra, Narendra ; ... - Advanced Materials Technologies

Additive-free, single step formulations of MXene-in-water inks are developed from clay-like titanium carbide (Ti ₃C ₂) sediments. Solution-processable Ti ₃C ₂ inks are compatible with stamping, printing, painting, and writing on a variety of substrates. Specifically, MXene-in-water inks at higher concentrations of 30 mg mL ^-1 are employed in commercially available pens for dispensing and patterning 2D MXene directly. These MXene pens are employed either manually or automatically using an AxiDraw, enabling direct-writing and complex patterning of functional MXene devices. Versatile MXene pens show compatible writing on a variety of substrates, including paper and polymers, where the deposited ink ismore »« less
https://doi.org/10.1002/admt.201800256
Laser-assisted direct ink writing of planar and 3D metal architectures

Journal Article Skylar-Scott, Mark A. ; Gunasekaran, Suman ; Lewis, Jennifer A. - Proceedings of the National Academy of Sciences of the United States of America

The ability to pattern planar and freestanding 3D metallic architectures at the microscale would enable myriad applications, including flexible electronics, displays, sensors, and electrically small antennas. A 3D printing method is introduced that combines direct ink writing with a focused laser that locally anneals printed metallic features “on-the-fly.” To optimize the nozzle-to-laser separation distance, the heat transfer along the printed silver wire is modeled as a function of printing speed, laser intensity, and pulse duration. Laser-assisted direct ink writing is used to pattern highly conductive, ductile metallic interconnects, springs, and freestanding spiral architectures on flexible and rigid substrates.
Cited by 31
https://doi.org/10.1073/pnas.1525131113
Laser writing: A new technique for fabrication of electronic and optoelectronic Y-Ba-Cu-O devices and circuits

Book Xiong, W ; Kula, W ; Sobolewski, R ; ...

The authors report their studies on the fabrication of YBa{sub 2}Cu{sub 3}O{sub x} (YBCO) thin-film structures, patterned with a laser-writing technique. They demonstrate that this patterning method can be successfully implemented in fabricating a variety of electronic and optoelectronic high-{Tc} devices and circuits. Depending on the film`s initial oxygen content and the ambient atmosphere, laser heating allows oxygen to diffuse in or out of the annealed region and form oxygen-rich (YBa{sub 2}Cu{sub 3}O{sub 7}; superconducting) patterns next to oxygen-depleted (YBa{sub 2}Cu{sub 3}O{sub 6}; insulating at low temperature) ones. The width of the YBa{sub 2}Cu{sub 3}O{sub 7-}YBa{sub 2}Cu{sub 3}O{sub 6} interfacemore »« less

Similar Records