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U.S. Department of Energy
Office of Scientific and Technical Information

Incision of uv irradiated DNA in yeast: Progress report, November 1, 1987-May 31, 1988

Technical Report ·
OSTI ID:6945819

The objectives are to determine the details of the incision step of excision repair following exposure to UV light in the yeast Saccharomyces cerevisiae. The approach is to focus on three of the 10 genes involved in this process - RAD1, RAD3, and RAD10. The three proteins are purified from yeast cells carrying overproducing plasmids for the respective proteins RAD3 protein has already been purified to near homogeneity, and, as predicted from features in the nucleotide sequence, was found to possess single-stranded DNA-dependent ATPase activity. It also has DNA helicase action during excision repair and will test its implications. Further characterization of the RAD3 protein is in progress, including its interaction with yeast DNA polymerase. The RAD1 and RAD10 proteins are being purified from yeast and will be characterized for various biochemical properties. The human RAD10 homolog is also being studied. Defective DNA repair and enhanced neoplasia characterize several human genetic diseases, thus, thorough understanding of the molecular mechanisms of DNA repair may provide a better understanding of the causes of carcinogenesis. 3 refs.

Research Organization:
Rochester Univ., NY (USA). School of Medicine and Dentistry
DOE Contract Number:
FG02-88ER60621
OSTI ID:
6945819
Report Number(s):
DOE/ER/60621-1; ON: DE88012461
Country of Publication:
United States
Language:
English