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Title: Plasma etching of Si and SiO/sub 2/: The effect of oxygen additions to CF/sub 4/ plasmas

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.325382· OSTI ID:6927381

The plasma etching of silicon and silicon dioxide in CF/sub 4/-O/sub 2/ mixtures has been studied as a function of feed-gas composition in a 13.56-MHz plasma generated in a radial-flow reactor at 200 W and 0.35 Torr. Conversion of CF/sub 4/ to stable products (CO, CO/sub 2/, COF/sub 2/, and SiF/sub 4/) and the concentration of free F atoms ((F)) in the plasma were measured using a number of different diagnostics. The rate of etching, the concentration of F atoms, and the intensity of emission from electronically excited F atoms (3s/sup 2/P--3p/sup 2/P/sup 0/ transition at 703.7 nm) each exhibit a maximum value as a function of feed-gas composition ((O/sub 2/)); these respective maxima occur at distinct oxygen concentrations. For SiO/sub 2/, the variation in etching rate with (O/sub 2/) is accounted for by a proportional variation in (F), the active etchant. The etching of silicon also occurs by a reaction with F atoms, but oxygen competes with F for active surface sites. A quantitative model which takes oxygen adsorption into account is used to relate the etch rate to (F). The initial increase of (F) with (O/sub 2/) is accounted for by a sequence of reactions initiating with the production of CF/sub 3/ radicals by electron impact and followed by a reaction of CF/sub 3/ with oxygen. When (O/sub 2/) exceeds approx.23% (under the present discharge conditions), (F) decreases due, probably, to a decrease in electron energy with an increase of oxygen in the feed gas.

Research Organization:
Bell Laboratories, Murray Hill, New Jersey 09794
OSTI ID:
6927381
Journal Information:
J. Appl. Phys.; (United States), Vol. 49:7
Country of Publication:
United States
Language:
English